TESCAN has released the S9000X, its latest flagship Xe plasma FIB-SEM. It is a useful tool for those involved in ultrahigh-resolution imaging and nanomachining, TEM lamellae preparation and 3D materials analysis.
The Xe plasma FIB (iFIB+) provides precise, damage-free, large-area cross-sectioning coupled with a high throughput rate, up to 50 times faster than conventional gallium FIBs. Furthermore, the use of Xe helps to overcome some of the drawbacks of using gallium including amorphisation, which can lead to incorrect analyses.
Another benefit of the iFIB+ Xe plasma FIB column is that it offers a good field of view resulting in the ability to carry out large-area cross-sectioning as well as offering high levels of automation. This will assist users by reducing the bottlenecks in TEM sample preparation and accelerating 3D materials characterisation.
The column is coupled with TESCAN’s next-generation TriGlav ultrahigh-resolution SEM. The three objective lens system used in the TriGlav column reduces aberration, allowing users to achieve sub-nanometre resolution (0.7 nm) while keeping the high current (400 nA). It also enables field-free imaging of magnetic samples and live monitoring of FIB operations. Energy-filtered axial BSE signal collection also provides enhanced surface sensitivity, while adaptive spot shape optimisation results in good contrast at all beam currents.
The SEM is also useful for 3D materials characterisation. With its specifically designed chamber geometry, it can easily incorporate multiple detectors including EDS, EBSD, CL, X-ray source and ToF-SIMS. ToF-SIMS can also be fully integrated and offers isotope identification as well as light element (down to hydrogen) detection, with Xe enhancing the already good detection limits (better than 5 ppm). The rapid rates of material removal make the system suitable for 3D materials analysis, including tomography.
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