Linseis thermal conductivity and thermal diffusivity measurement

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Knowledge of heat transport properties of solids and liquids is becoming more and more crucial. The automotive, aviation, aerospace, power generation, energy, ceramic and glass industries rely on precise information about the thermal behaviour of their used materials. Heat management is also important in the building industry, due to exploding energy costs, and in the semiconductor industry due to highly charged integrated devices.

Linseis’s extensive experience in thermal properties measurement covers broad-ranging systems that measure thermal conductivity, thermal diffusivity and specific heat.

The company’s laser flash (LFA)/xenon flash (XFA) technique is a fast method of measuring thermal conductivity and diffusivity properties of samples. It enables determination from -125°C up to 600°C (xenon flash) or -125°C up to 2800°C (laser flash) in the range of 0.1 W/mK to 2000 W/mK. Both operate in agreement with national and international standards such as ASTM E-1461, DIN 30905 and DIN EN821.

The transient hot bridge (THB) technique enables thermal conductivity, diffusivity and specific heat measurements in the temperature range -50 to 200°C with measuring range of 0.01 to 500 W/mK. It can measure solids, gels and pastes, as well as liquids, with precise, automatic measurements within minutes. A large number of sensor types are available for a broad range of applications.

The company’s heat flow meter (HFM) is an easy-to-use instrument with rapid determination of thermal conductivity properties of low insulation materials. The product relies on the measurement principle of positioning a sample between a hot and a cold plate to measure the heat flow. It has been designed for ASTM C518, JIS A1412, ISO 8301 and DIN 12667.